? 1995 mos field effect transistor 2sj448 switching p-channel power mos fet data sheet document no. d10029ej2v0ds00 (2nd edition) date published july 2001 ns cp(k) printed in japan the mark shows major revised points. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. description the 2sj448 is p-channel mos field effect transistor designed for high voltage switching applications. features ? 250 v rating high withstand voltage ? low on-state resistance: r ds(on) = 2.0 ? max. (v gs = ?10 v, i d = ?2.0 a) ? low input capacitance: c iss = 470 pf typ. ? narrow gate cut-off voltage width: v gs(off) = ? 5.5 to ? 4.0 v ? built-in gate protection diode ? full-mold package for easy mounting absolute maximum ratings (t a = 25c) drain to source voltage (v gs = 0 v) v dss ?250 v gate to source voltage (v ds = 0 v) v gss m 30 v drain current (dc) (t c = 25c) i d(dc) m 4.0 a drain current (pulse) note1 i d(pulse) m 16 a total power dissipation (t c = 25c) p t1 30 w total power dissipation (t a = 25c) p t2 2.0 w channel temperature t ch 150 c storage temperature t stg ?55 to +150 c single avalanche current note2 i as ?4.0 a single avalanche energy note2 e as 80 mj notes 1. pw 10 s, duty cycle 1% 2. starting t ch = 25c, v dd = ?125 v, r g = 25 ? , v gs = ?20 0 v ordering information part number package 2sj448 isolated to-220 (isolated to-220)
data sheet d10029ej2v0ds 2 2sj448 electrical characteristics (t a = 25c) characteristics symbol test conditions min. typ. max. unit zero gate voltage drain current i dss v ds = ?250 v, v gs = 0 v ? 100 a gate leakage current i gss v gs = m 25 v, v ds = 0 v m 10 a gate cut-off voltage v gs(off) v ds = ?10 v, i d = ?1 ma ?4.0 ?4.8 ?5.5 v forward transfer admittance | y fs |v ds = ?10 v, i d = ?2.0 a1.02.3s drain to source on-state resistance r ds(on) v gs = ?10 v, i d = ?2.0 a1.52.0 ? input capacitance c iss v ds = ?10 v 470 pf output capacitance c oss v gs = 0 v 200 pf reverse transfer capacitance c rss f = 1 mhz 70 pf turn-on delay time t d(on) v dd = ?125 v, i d = ?2.0 a 13 ns rise time t r v gs = ?10 v7ns turn-off delay time t d(off) r g = 10 ? 34 ns fall time t f 10 ns total gate charge q g v dd = ?200 v15nc gate to source charge q gs v gs = ?10 v4nc gate to drain charge q gd i d = ?4.0 a9nc body diode forward voltage v f(s-d) i f = 4.0 a, v gs = 0 v1.0v reverse recovery time t rr i f = 4.0 a, v gs = 0 v 195 ns reverse recovery charge q rr di/dt = 50 a / s 760 nc test circuit 1 avalanche capability test circuit 2 switching time r g = 25 ? 50 ? l v dd v gs = ?20 0 v bv dss i as i d v ds starting t ch r g = 10 ? d.u.t. pg. pg. 0 r l v dd v gs i d ( ? ) 0 0 10% 10% 90% 90% 10% 90% i d v gs t d (off) t d (on) t on t off t f t r test circuit 3 gate charge d.u.t. r l v dd 50 ? i g = ?2 ma pg. v dd v gs ( ? ) r g d.u.t. v gs wave form i d wave form = 1 s duty cycle 1%
data sheet d10029ej2v0ds 3 2sj448 typical characteristics (t a = 25c) drain current vs. drain to source voltage v ds - drain to source voltage - v i d - drain current - a forward transfer characteristics v gs - gate to source voltage - v i d - drain current - a ? 0.1 derating factor of forward bias safe operating area t c - case temperature - ?c dt - percentage of rated power - % total power dissipation vs. case temperature t c - case temperature - ?c p t - total power dissipation - w 0 20 40 60 80 100 120 140 160 35 30 25 20 15 10 5 0 ?0 ?5 ?0 ?5 ?.0 ?0 ?00 pulsed ?0 ? 0 pulsed ? ?0 t a = ?5?c 25?c 75?c 125?c ? v ds = ?0 v forward bias safe operating area v ds - drain to source voltage - v i d - drain current - a ?.1 ? ?.0 ?0 ?00 ?0 ?00 ?000 r ds(on) limited i d(pulse) pw = 100 s 10 ms 1 ms power dissipation limitted 0 20 40 60 80 100 120 140 160 20 40 60 80 100 dc i d(dc) t c = 25?c single pulse v gs = ?0 v ?0 v
data sheet d10029ej2v0ds 4 2sj448 forward transfer admittance vs. drain current i d - drain current - a |y fs | - forward transfer admittance - s drain to source on-state resistance vs. gate to source voltage v gs - gate to source voltage - v r ds(on) - drain to source on-state resistance - ? 0 5 drain to source on-state resistance vs. drain current gate to source cut-off voltage vs. channel temperature t ch - channel temperature - ? c v gs(off) - gate to source cut-off voltage - v i d - drain current - a r ds(on) - drain to source on-state resistance - ? 2.0 0.1 v ds = 10 v pulsed 1.0 1.0 10 100 10 100 1.0 3.0 10 15 pulsed 4.0 1.0 10 pulsed 0 6.0 2.0 v ds = 10 v i d = 1 ma 4.0 6.0 8.0 50 0 50 100 150 0 0.1 2.0 transient thermal resistance vs. pulse width pw - pulse width - s r th(t) - transient thermal resistance - ? c/w 10 0.001 0.01 0.1 1 100 1000 1 m 10 m 100 m 1 10 100 1000 10 100 single pulse r th(ch-c) = 4.17 ? c/w 0.1 v gs = 10 v ? r th(ch-a) = 62.5 ? c/w t a = 25 ? c 25 ? c 75 ? c 125 ? c i d = 4.0 a 2.0 a 0.8 a
data sheet d10029ej2v0ds 5 2sj448 drain to source on-state resistance vs. channel temperature t ch - channel temperature - ? c r ds(on) - drain to source on-state resistance - ? source to drain diode forward voltage v sd - source to drain voltage - v i sd - diode forward current - a capacitance vs. drain to source voltage v ds - drain to source voltage - v c iss , c oss , c rss - capacitance - pf switching characteristics i d - drain current - a t d(on) , t r , t d(off) , t f - switching time - ns 1.0 0.1 0 50 1.0 2.0 3.0 0 50 100 150 i d = 2.0 a 0.1 0 1 10 100 0.5 pulsed 1.0 1.0 10 100 1000 10 100 1000 v gs = 0 v f = 1 mhz 10 100 1000 1.0 10 100 v gs - gate to source voltage - v reverse recovery time vs. drain current i d - drain current - a t rr - reverse recovery time - ns di/dt = 50 a/ s v gs = 0 v 10 0.1 100 1000 10000 1.0 10 100 1.0 1.5 4.0 v dd = 125 v v gs = 10 v r g = 10 ? dynamic input/output characteristics q g - gate charge - nc v ds - drain to source voltage - v 0 4 8 12 16 100 200 i d = 4.0 a 4 8 12 16 v gs = 10 v c iss t r t f v gs = 0 v ? 10 v 0 c rss c oss t d(on) t d(off) v dd = 200 v 125 v 50 v
data sheet d10029ej2v0ds 6 2sj448 single avalanche current vs. inductive load l - inductive load - h i as - single avalanche current - a single avalanche energy derating factor starting t ch - starting channel temperature - ? c energy derating factor - % 1.0 0 25 10 100 100 1 m 10 m 100 m v dd = 125 v v gs = 20 0 v r g = 25 ? 20 80 120 160 50 75 100 125 150 100 60 40 140 e as = 80 mj i d = 4.0 a 0.1 v dd = 125 v r g = 25 ? v gs = 20 0 v i as 4 a
data sheet d10029ej2v0ds 7 2sj448 package drawing (unit: mm) 10.0 0.3 3.2 0.2 4.5 0.2 2.7 0.2 2.5 0.1 0.65 0.1 1.5 0.2 2.54 1.3 0.2 2.54 0.7 0.1 4 0.2 15.0 0.3 12.0 0.2 3 0.1 123 1.gate 2.drain 3.source 13.5 min. isolated to-220(mp-45f) remark the diode connected between the gate and source of the transistor serves as a protector against esd. when this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. equivalent circuit source body diode gate protection diode gate drain
2sj448 m8e 00. 4 the information in this document is current as of july, 2001. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
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